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Year: 2019 Language: Inglés Subject: Química Subject: Cobre

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Title: Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
Author: Pasquale, Miguel Ángel / Gassa, Liliana Mabel / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cobre / electrodeposition / electrochemical impedance spectroscopy / scanning electron microscopy / Sulfato de Cobre / polyethylene glycol

Acceder
Title: The formation of anodic layers on annealed copper surfaces in phosphate-containing solutions at different pH
Author: Laz, María Milagros / Souto, Ricardo M. / González, Sergio G. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Electroquímica / Cobre / Fosfatos / scanning electron microscopy / Técnicas Electroquímicas / Rayos X

Acceder
Title: Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging : Influence of a thiourea additive on the kinetics of roughening and brightening
Author: Mendez, S. / Andreasen, Gustavo / Schilardi, Patricia Laura / Figueroa, M. / Vázquez, L. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / electrodeposits / Tiourea / Topografía / Cobre / polycrystalline / Cinética química

Acceder
Title: Electrochemical behaviour of copper in aqueous moderate alkaline media, containing sodium carbonate and bicarbonate, and sodium perchlorate
Author: Pérez Sánchez, M. / Barrera, M. / González, Sergio G. / Souto, Ricardo M. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Electroquímica / Cobre / Carbonato de Sodio / voltammetry / Metales Alcalinos / scanning electron microscopy

Acceder
Title: The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions. Open circuit potentials and electrochemical kinetics
Author: Bolzán, Agustín E. / Wakenge, I. B. / Piatti, Roberto C. V. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cobre / Ácidos Sulfúricos / Electroquímica / Cinética química / Tiourea / Electrólitos

Acceder
Title: Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
Author: Gennero de Chialvo, Maria Rosa / Salvarezza, Roberto Carlos / Vásquez Moll, Victor Dennis / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cinética química / Corrosión / Cloruro de Sodio / Electrón / pitting corrosion / Cobre

Acceder
Title: The influence of slow Cu(OH)₂ phase formation on the electrochemical behaviour of copper in alkaline solutions
Author: Gomez Becerra, J. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Electroquímica / Cobre / Discos Rotatorios / potentiodynamic / alkaline solutions / electroreduction

Acceder
Title: Comment on "The diatomic dication CuZn²⁺ in the gas phase" [J. Chem. Phys. 135, 034306 (2011)]
Author: Fišer, Jiri / Pis Diez, Reinaldo / Franzreb, Klaus / Alonso, Julio A.
Language: Inglés
Repository: 37
Subject: Química / Cobre / Zinc

Acceder
Title: Electrochemical study of the diffusion of cupric ion in aqueous and aqueous-glycerol solutions containing sulphuric acid
Author: Arvia, Alejandro Jorge / Bazán, Julio César / Carrozza, J. S. W.
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Electroquímica / Cobre / Glicerol / Discos Rotatorios / Viscosidad / Electrodos

Acceder
Title: Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
Author: Vázquez, L. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cobre / electrodeposition / Tiourea / Microscopía de Fuerza Atómica / Modelo de crecimiento / Fractales

Acceder

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