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Subject: Cobre Subject: Tiourea Document Type: Artículo Language: Inglés

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Title: Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging : Influence of a thiourea additive on the kinetics of roughening and brightening
Author: Mendez, S. / Andreasen, Gustavo / Schilardi, Patricia Laura / Figueroa, M. / Vázquez, L. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / electrodeposits / Tiourea / Topografía / Cobre / polycrystalline / Cinética química

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Title: The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions. Open circuit potentials and electrochemical kinetics
Author: Bolzán, Agustín E. / Wakenge, I. B. / Piatti, Roberto C. V. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cobre / Ácidos Sulfúricos / Electroquímica / Cinética química / Tiourea / Electrólitos

Acceder
Title: Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
Author: Vázquez, L. / Salvarezza, Roberto Carlos / Arvia, Alejandro Jorge
Language: Inglés
Repository: 37
Subject: Ciencias Exactas / Química / Cobre / electrodeposition / Tiourea / Microscopía de Fuerza Atómica / Modelo de crecimiento / Fractales

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